| Product/Product Line |
Equipment Photo |
Application Description |
| Fine Pitch Stencil Printing |
 |
MPM model #SPM, a semi-automatic programmable stencil printer. Maximum board size 20.5 x 18.5. Board thickness up to .250. Repeatable stencil alignment (down to 16mil pitch) using a dual camera system targeting fiducials on the PWB. Programmable squeegee speed and pressure. Storage of up to 200 independent programs. |
| Fine Pitch Surface Mount Capabilities |
 |
Topaz 1 & 2 Chipmounter - Assembleon (Philips) GEM family of placement equipment rated at 12,000 placements per hour. Maximum board size 18.0 x 16.0. Board thickness up to .255. Single beam gantry style machine with one head housing 8 independent nozzles. Fiducial camera mounted on head for accurate pwb alignment. Upward-looking component camera for on-the-fly component recognition and alignment. One hundred independent feeder locations housing pneumatically indexed feeders. Max feeder count dependent on feeder sizes (8mm=1 slot, 12mm=2 slots, 24mm=3 slots, etc.). Step and repeat programming for multiple image panels. Component recognition from 0402 chip to 32mm x 32mm, leaded down to 25 mil.
Emerald Flexplacer w/LCS - Assembleon (Philips) GEM family of placement equipment rated at 8,000 placements per hour. Maximum board size 18.0 x 16.0. Board thickness up to .255. Single beam gantry style machine with one head housing 2 independent nozzles. Fiducial camera mounted on head for accurate pwb alignment. Two upward-looking component cameras (1 low resolution and 1 medium resolution) plus a laser system for on-the-fly component recognition and alignment. One hundred independent feeder locations housing pneumatically indexed feeders. Max feeder count dependent on feeder sizes (8mm=1 slot, 12mm=2 slots, 24mm=3 slots, etc.) Step and repeat programming for multiple image panels. Component recognition from 0402 chip to 32mm x 32mm BGA down to 16 mil pitch. LCS tray feeder allows presentation of up to 78 independent part numbers from matrix trays. Machine also has belt and vibratory feeder capability for presentation of parts from DIP tubes.
|
| Convection Reflow |
 |
Heller model #1706EXL full convection reflow oven. 6 independent, 350C heat zones top and bottom with 1 cooling zone, top only. Lead-free capable. Speed programmable pin chain or mesh belt transport. Integrated KIC profiling software. Nitrogen capable for inert reflow.
|
| Wavesolder |
 |
Technical Devices model #Nu-Era Jr. Maximum board width of 10.0. Two-zone pre-heat with adjustable conveyor speed control. Finger type transport system with selective solder pallet capability. |
| Waterwash 1 & 2 |
 |
Aqueous Technologies model #AQ-400 batch wash system. Water feed from a stand-alone DI system. Programmable pre-wash, wash, rinse, and dry cycles. Saponifier injection capability in the wash cycle. |
| Ersascope |
 |
Ersa Inspection System 3000. Integrated camera and lighting system designed to allow the operator to see under BGA style packages. Used for ball size/shape comparison and inspection of outer rows of balls for process development and troubleshooting. |
| QFP & BGA Replacement Station Services |
 |
Hot air topside heating uses targeted energy distribution for perfect results. Large area IR bottom preheater prevents board warp. PC, monitor, keyboard, video capture card, Windows 98 operating system, and Easy Solder software included. Profiles for any component can be created, displayed and easily modified with included thermocouples. |
